2UUL Joint X Solder Paste 158°C 50g (GS158)
2UUL Joint X Solder Paste 158°C 50g (GS158)
- Brand 2UUL
- Packaging Retail
- Manufacturer Ref GS158
- SKU 166939
- EAN Code 3667075246855
- Warranty N/A
In stock
2UUL Joint X - Low Temperature Solder Paste 158°C (GS158)
Technical Description
The 2UUL GS158 solder paste (Joint X Series) is a high-precision solder cream designed for advanced electronic repairs. Its main feature is its lowered melting point of 158°C, making it the ideal tool for working on modern motherboards that are increasingly dense and fragile. This controlled temperature significantly limits the thermal stress imposed on integrated circuits (ICs) and processors during reballing or soldering phases.
Its homogeneous texture and fine particle size allow for extremely precise application, even on the densest stencils. The GS158 guarantees clean solders with excellent electrical conductivity, while offering valuable flexibility when removing complex components.
Technical Specifications
- Reference: 2UUL GS158 (Joint X Series)
- Melting temperature: 158°C (Low Temperature)
- Weight: 50g
- Alloy: High purity Sn42/Bi58 (Tin/Bismuth)
- Flux Type: No-Clean (neutral residues, does not require aggressive cleaning)
- Particle Size: Type 4 (optimised for miniature SMD and BGA components)
- Application: iPhone "sandwich" motherboard soldering, battery connectors, sensitive components.
Benefits for the Repairer
- Maximum Thermal Safety: Protects sensitive components (CPU, NAND, WiFi) by avoiding prolonged exposure to high temperatures.
- "Sandwich" Specialist: Facilitates the reballing of interposers on recent iPhones (X to 15 Pro Max) thanks to its reduced melting temperature.
- Impeccable Finish: Produces uniform and shiny solder joints without solder balling.
- Practicality of use: Its viscosity is designed to remain stable on the stencil without drying prematurely.
- Energy and time saving: Requires less heating time with the hot air station, thus reducing the risk of PCB deformation.
Workshop tip: To preserve the chemical properties of the GS158 paste, it is strongly recommended to keep it cool (between 5°C and 10°C). Before use, leave the pot at room temperature for 20 to 30 minutes. Ensure the lid is tightly closed after each use to prevent early oxidation.
In stock