2UUL Joint X - Standard Solder Paste 183°C (GS183)

Technical Description

2UUL GS183 solder paste (Joint X Series) is the essential benchmark for electronic maintenance technicians. Its formula, calibrated at 183°C, offers perfect melting stability, ensuring solid and durable solder joints. Unlike lead-free alloys which are often difficult to handle, the GS183 allows for rapid and uniform reflow, significantly reducing the exposure time of components to hot air heat.

Its Type 4 particle size ensures smooth passage through the finest stencils, preventing soldering defects such as bridges or solder balls. It is the ideal paste for bringing smartphone, tablet, and gaming console motherboards back to life with a finish quality equivalent to manufacturing plants.

Technical Specifications

• Reference: 2UUL GS183 (Joint X Series)
• Melting Temperature: 183°C (Eutectic Point)
• Weight: 50g
• Alloy: Sn63 / Pb37 (Tin 63% / Lead 37%)
• Flux Type: Integrated high-quality No-Clean flux
• Particle Size: Type 4 (20-38 micron particles for high precision)
• Application: Chip reballing (BGA), integrated circuit (IC