2UUL Joint X - High Performance Solder Paste 200°C (GS200)

Technical Description

The 2UUL GS200 solder paste (Joint X Series) is a professional-grade soldering solution packaged in a 50g pot. With a melting point calibrated at 200°C, this variant offers an ideal compromise between classic 183°C alloys and high-temperature solders. It is specifically formulated to provide stable viscosity, preventing excessive spreading during heating and guaranteeing perfectly uniform solder balls during reballing operations.

Its formula incorporates a high-quality flux that limits oxidation and facilitates instant melting under hot air. The GS200 stands out for its ability to create shiny, strong, and highly conductive solder joints, essential for the longevity of repairs on smartphone, tablet, and laptop motherboards.

Technical Specifications

• Reference: 2UUL GS200 (Joint X Series)
• Melting temperature: 200°C
• Weight: 50g
• Alloy: Optimised Sn/Ag/Cu (Tin/Silver/Copper)
• Flux Type: No-Clean (minimal and non-corrosive residues)
• Particle Size: Type 4 (ultra-fine particles for precision stencils)
• Application: CPU/GPU reballing, charging connector soldering, IC reballing

Benefits for the Repairer

• Thermal Stability: The 200°C melting point ensures joints that are more resistant to mechanical shocks and internal temperature variations of the device.
• Finish Quality: Produces smooth and shiny solders, facilitating visual inspection and quality control.
• Bridge Reduction: Its pasty texture allows for precise stencil application without smearing, reducing the risk of short circuits between pads.
• High Performance Flux: Excellent "wetting" capability that allows the solder to adhere instantly to surfaces, even those slightly oxidised.
• Optimised Storage: Formula designed not to dry out quickly in the pot, extending the product's usable life.

Workshop tip: To maintain all the properties of your 2UUL paste, store the pot in the refrigerator (between 5°C and 10°C) when not in use. Before application, allow the paste to return to room temperature for approximately 30 minutes to ensure perfect viscosity when spreading on your stencils.