IC BEST BST-69A+ IC Cleaning and Lifting Tool Set (4 Blades)

Description

The BEST BST-69A+ set is an essential precision instrument for advanced micro-soldering operations, particularly for cleaning epoxy glue residues (underfill) surrounding CPU, NAND, and WiFi chips on smartphone motherboards. This kit has been specifically developed to offer technicians a delicate lifting and scraping solution, allowing intervention on high-density SMD components without damaging the solder mask of the printed circuit board.

The tool consists of a high-resistance anodised aluminium handle, featuring a precision thread for a firm grip on the blades. The handle surface features an anti-slip relief machining, ensuring stable handling under a microscope, where the slightest slip can be fatal to the copper tracks. The four included blades offer distinct geometric profiles (pointed, bevelled, and flat), allowing the angle of attack to be adapted according to the work area, whether for separating ribbon cable layers or removing residual solder on BGA pads.

Manufactured from a high-performance steel alloy, the BST-69A+ blades maintain their rigidity and sharpness even during prolonged exposure to the thermal flux of hot air stations. Their exceptional thinness (approximately 0.1mm) allows for capillary insertion under integrated circuits during the desoldering phase, facilitating uniform and secure lifting of chips without risky mechanical torsion.

Technical Specifications

• Manufacturer reference: BST-69A+ (Multifunctional Glue Remover)
• Handle material: Anodised aluminium with textured grip
• Blade material: High-hardness alloy steel
• Compatibility: Universal electronics repair (iPhone, Android, high-density PCB)
• Fixing system: Quick-tightening rotary chuck
• Number of accessories: 4 interchangeable blades with various profiles
• Blade thickness: Ultra-thin (designed for underfill)
• Properties: High thermal resistance and anti-corrosion

Workshop Advice & Usage

To maximise the lifespan of your BEST BST-69A+ blades, we recommend applying slight heat (around 150°C) to the resin surrounding the component before starting to scrape; this allows the blade to slide effortlessly and reduces the risk of tip breakage. It is imperative to clean the blade with isopropyl alcohol after each glue removal to prevent the accumulation of carbonised residues that could reduce the precision of the cutting edge. Finally, ensure you never use these blades to lever rigid components such as metal shields.