DUSTY ROW-10 Thermal Insulation Plate

Description

The DUSTY ROW-10 is a high-precision thermal protection tool, specifically designed for micro-soldering operations on modern display panels. During chip transfers (IC Transplant) on iPhone or high-end smartphone screens, the heat required for desoldering (often exceeding 350°C) can irremediably damage the backlight layers or the organic structure of the OLED pixels located in the immediate vicinity. This insulating plate acts as a refractory shield, isolating the sensitive part of the screen during work on the flex cable.

Manufactured from industrial-grade thermal silicone, the ROW-10 features exceptional thermal inertia capable of absorbing heat flows up to 500°C. Its non-slip texture ensures that the screen remains perfectly still on the workbench, while its thinness allows it to be precisely inserted under flexible connectors without creating mechanical tension on the glass. It is a critical safety consumable to guarantee a 100% success rate on complex repairs related to "Unknown Part" messages or True Tone restoration.

This pack of 5 units allows repair shops to equip multiple workstations or have ready-to-use spare parts available. Unlike makeshift protections (Kapton tape alone), the DUSTY ROW-10 offers a calibrated thickness and density for optimal heat dissipation without the risk of adhesive residue transfer onto the panel.

Technical Specifications

• Manufacturer Reference: DUSTY ROW-10
• Material: High-performance thermal silicone (High-Density)
• Compatibility: Universal (Specially optimised for iPhone 11 to 16 series and OLED screens)
• Dimensions: Compact format suitable for IC areas (approx. 70mm x 60mm)
• Weight: ~10g per unit
• Thermal Resistance: Certified up to 500°C
• Packaging: Pack of 5 insulating plates

Workshop Advice & Usage

For optimal protection, we recommend pairing the use of the DUSTY ROW-10 with Kapton tape on peripheral areas. Gently slide the plate under the flex cable to be worked on, ensuring it completely covers the area of the screen located under your hot air nozzle. After the operation, wait for complete cooling before removing the plate to avoid any residual deformation of the flex cable. Easy cleaning with isopropyl alcohol to remove solder flux splashes and maintain a clean work surface.