MECHANIC FJ201 Green Insulated Ultra-Fine Wire 0.01mm - 200m

Description

The Mechanic FJ201 shunt wire is the ultimate tool for experts in micro-soldering and printed circuit board reconstruction. With a microscopic diameter of only 0.01mm, it allows to restore interrupted connections on the motherboards of latest generation smartphones, where track density is maximum. This wire is particularly recommended for bridging internal tracks after a "pad" tear under a CPU, a Wi-Fi chip, or a NAND memory, ensuring an invisible and technically reliable repair.

The main feature of the FJ201 lies in its high-density green varnish insulation. This dielectric coating allows for complex bridging without risk of accidental contact with surrounding components or adjacent tracks. Unlike bare copper wires, the FJ201 allows for crossing of shunts, which is essential when reconstructing multi-layer FPC ribbons or damaged charging connectors. Despite its extreme thinness, the copper used offers electrical conductivity of over 99%, ensuring signal and power integrity.

The 200-meter spool packaging ensures a long service life in the workshop. The insulating varnish is designed to be "self-stripping" under the thermal action of the soldering iron (around 380°C), facilitating direct tinning at the ends without requiring mechanical stripping that could weaken the wire. Its exceptional malleability allows to follow original track layouts with surgical precision under a microscope.

Technical Specifications

• Manufacturer Reference: MECHANIC FJ201
• Material: High Conductivity Pure Copper/Green Insulating Varnish
• Diameter: 0.01 mm
• Length: 200 meters
• Compatibility: CPU, NAND, FPC, BGA track repair
• Properties: Insulated (Dielectric), Self-stripping when heated
• Packaging: Precision spool

Workshop & Usage Advice

Due to its extremely small section, this wire must be handled exclusively with titanium tweezers with ultra-fine tips to avoid crushing or cutting it. To secure your jumpers once soldered, we recommend applying a drop of Mechanic green UV varnish (Solder Mask) to mechanically secure the wire and prevent it from moving during future cleanings with isopropyl alcohol or when installing a BGA component.