MECHANIC Active Formula Soldering Flux (SF38)

Description

The MECHANIC Active Formula Soldering Flux (SF38) is designed to improve the efficiency of soldering processes in electronics. Its advanced formulation ensures excellent wettability and a significant reduction of residues, thus facilitating post-soldering cleaning. This flux is ideal for applications requiring increased precision and reliability. It is suitable for a variety of metals, ensuring strong and durable connections.

Technical Specifications

• Active chemical formulation for improved wettability.
• Residue reduction for simplified cleaning.
• Compatible with a wide range of metals.
• Optimized viscosity for precise application.
• Operating temperature: 180°C to 260°C.
• Packaging: 100 ml bottle.
• Compliant with RoHS safety standards.
• Shelf life: 12 months at room temperature.

Benefits

• Improved solder quality thanks to increased wettability.
• Reduced cleaning time due to minimal residues.
• Increased durability of soldered connections.
• Easy application with suitable viscosity.
• Compliance with safety standards for risk-free use.

Applications

• Soldering of sensitive electronic components.
• Assembly of printed circuits in the electronic industry.
• Repair of consumer electronic devices.
• Prototyping and development of new electronic products.
• Maintenance of industrial electronic systems.