MECHANIC Multifunction Disassembly Blade (Renying 003)

MECHANIC Multifunction Disassembly Blade (Renying 003)

Caractéristiques
  • Brand Mechanic Mechanic
  • Packaging Retail
  • Manufacturer Ref Renying 003
  • SKU 188902
  • EAN Code 6971331464735
  • Warranty N/A
$3.02

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Product Description

MECHANIC Renying 003 High Precision Disassembly Blades

Description

The MECHANIC Renying 003 set is a specialised tool kit for level 3 micro-maintenance (Level 3 Repair). It is designed to solve one of the most complex challenges in smartphone repair: the removal of integrated components protected by epoxy resin (Underfill). Thanks to a thickness of only 0.1 mm, these blades allow insertion between the processor and the PCB with minimal resistance, facilitating the lifting of BGA chips, CPUs, and NAND memories during reballing or data transfer operations.

From a technical perspective, each blade is forged from a high-elasticity steel alloy. This property is fundamental because it allows the tool to deform slightly under the chip without breaking, then return to its initial shape. The precision sharpening of the edges is designed to slice through resin softened by heat while gliding over the motherboard's protective varnish (Solder Mask), thus drastically reducing the risk of tearing tracks or pads, a frequent incident with thicker or less flexible tools.

The included ergonomic handle offers a stable grip and a quick-fix system for the different heads. The set offers various shapes: hook blades to clear the contour of components, wide spatulas for uniform lifting, and bevelled tips for cleaning stubborn glue residues on flat surfaces.

Technical Specifications

  • Manufacturer Reference: Renying 003 (IC Glue Remover Series)
  • Material: High-performance alloy steel (Elastic Stainless Steel)
  • Blade thickness: 0.1 mm
  • Compatibility: Universal (Standard handle for micro-surgery blades)
  • Number of blades: Multi-function assortment (CPU, NAND, Baseband)
  • Hardness: High flexibility with shape memory
  • Resistance: Withstands direct exposure to hot air (>400°C)
  • Application: Epoxy resin removal, BGA chip lifting, PCB layer separation

Workshop Advice & Usage

For a successful CPU removal with the Renying 003 kit, set your hot air station between 250°C and 300°C to soften the Underfill. Use the hook blade to delicately trace around the component before inserting the flat blade. Never force the insertion: the blade should slide in thanks to the heat. After each intervention, clean the blades using a stiff-bristled brush and isopropyl alcohol to remove carbonised polymer residues, in order to maintain an optimal edge for the next intervention.

$3.02

Restocking

Be alerted when available
Notify me Vous serez alerté quand ce produit sera de nouveau en stock
$3.02

Restocking

Be alerted when available
Notify me Vous serez alerté quand ce produit sera de nouveau en stock