MECHANIC XGSP50 Solder Paste 183°C (42g)

Description

The Mechanic XGSP50 solder paste is an essential industrial-grade consumable for high-precision micro-soldering operations. Composed of a Sn63/Pb37 alloy (Tin/Lead), it offers a stable and precise melting point at 183°C. This eutectic characteristic is crucial for technicians performing integrated circuit (BGA) reballing, as it allows simultaneous melting of all tin balls, ensuring a perfect electrical connection and a robust mechanical structure between the component and the motherboard.

The XGSP50 formulation incorporates a Type 4 particle size distribution, specially designed for high-density stencil applications. The tin micro-particles are suspended in a high-quality flux that facilitates wetting and limits oxidation during heating. Its viscosity is optimized to adhere perfectly to the pads without dripping, allowing for clean demolding of the stencil, even on components with very fine pitches such as NAND chips or latest generation processors.

Beyond its thermal performance, this paste leaves very few residues after soldering. The few remaining residues are non-corrosive and highly insulating, although cleaning with isopropyl alcohol is recommended for a professional aesthetic finish. Its 42g pot packaging is ideal for intensive use in workshops, offering an excellent cost-effective ratio for repair centers dealing with large volumes of logic boards.

Technical Specifications

• Manufacturer Part Number: MECHANIC XGSP50
• Material: Sn63/Pb37 Alloy (Leaded)
• Melting Point: 183°C
• Particle Size Distribution: 20 - 38 µm (Type 4)
• Net Weight: 42 g
• Integrated Flux: No-Clean Type (High Activity)
• Application: BGA Reballing, SMD/SMT Microsoldering

Workshop Tips & Usage

To ensure optimal soldering performance, the Mechanic XGSP50 paste should be stored in the refrigerator (between 0°C and 10°C) to prevent separation of the flux and metal particles. Before use, remove the pot about 30 minutes in advance to allow it to come to room temperature, then gently mix the paste with a clean spatula. If the paste becomes too dry after several weeks of opening, never add alcohol, but use a drop of compatible liquid flux to restore its original viscosity.