MECHANIC XZ10 Solder Balls 0.2mm x10,000

Description

The MECHANIC XZ10 0.2mm solder balls are specially designed for reballing operations on BGA, CSP, and other microelectronic components. They allow for the repair or replacement of solder balls on integrated circuits as part of maintenance or rework interventions. Their 0.2mm diameter is ideal for very small components, requiring high precision and perfect distribution uniformity. Compliant with professional standards, these solder balls ensure excellent conductivity and optimal wetting to guarantee a reliable attachment to the pads. Packaged in a secure bottle, they are perfect for specialized micro-soldering workshops in mobile telephony and fine electronics.

Technical Specifications

• Brand: MECHANIC
• Model: XZ10
• Type: Solder balls for reballing
• Diameter: 0.2mm
• Quantity: Approximately 10,000 balls
• Application: BGA, CSP, microelectronic components reballing
• Alloy: Sn63/Pb37 (63% tin / 37% lead)
• Melting Temperature: Approximately 183°C
• Packaging: Moisture-proof airtight bottle
• Usage: Compatible with BGA stencil, reballing plate, and hot air station

Advantages

• High precision: Calibrated 0.2mm balls for reballing very small footprint components.
• Professional quality: Sn63/Pb37 composition offering excellent conductivity and wetting.
• Extended compatibility: Usable on most BGA, CSP, and CMS circuits.
• Secure packaging: Resealable bottle protecting balls from moisture and contamination.
• Homogeneous production: Regular distribution and strict dimensional control.

Recommended Applications

Recommended for micro-soldering workshops, mobile repair technicians, BGA rework specialists, and any professional working on miniature electronic components requiring precision reballing.

Package Contents

• 1 x Bottle of MECHANIC XZ10 solder balls - 0.2mm (approximately 10,000 balls)