MECHANIC XZ10 0.5mm Solder Balls x10,000

Description

The MECHANIC XZ10 0.5mm Solder Balls are specially designed for reballing electronic components, particularly BGA (Ball Grid Array) circuits found on the motherboards of smartphones, tablets, and other electronic devices. Their tin-lead alloy composition ensures excellent conductivity and optimal adhesion during microsoldering operations.

With a diameter of 0.5 mm and a quantity of 10,000 balls, this flask is ideal for professional repairers seeking a reliable and precise material. Tested and approved by The Repair Academy, these balls offer homogeneous fusion and excellent mechanical resistance after soldering.

Specifications

• Brand: MECHANIC
• Model: XZ10
• Type: Solder balls for reballing
• Diameter: 0.5 mm
• Quantity: 10,000 balls
• Composition: Tin-lead alloy
• Use: BGA reballing, motherboard and printed circuit board repair
• Homogeneous fusion: Ensures optimal component adhesion
• Quality: Tested and approved by The Repair Academy

Advantages

• Maximum precision: 0.5 mm diameter ideal for BGA reballing.
• Homogeneous fusion: Ensures uniform distribution and excellent adhesion.
• High conductivity: Alloy optimized for strong and durable connections.
• Large capacity: 10,000 balls for extended use.
• Professional validation: Product tested and approved by The Repair Academy.

Recommended Use

Ideal for electronic repair technicians and microsoldering professionals requiring a high-quality product for BGA circuit reballing.

Pack Contents

• 1 x Flask of 10,000 MECHANIC XZ10 Solder Balls (0.5mm)